Abstract

Recovery of used slurry from wire sawing of silicon wafers is important from both cost and environmental aspects of silicon wafer manufacturing. The mechanisms proposed for wire sawing of silicon wafers are briefly reviewed to help understand the nature of used slurry. Various processes that have been proposed for recovering slurry are reviewed and the merits and deficiencies of such processes are discussed. The basic physical principles and the various unit operations used in the recovery process are described. Criteria for selection of appropriate recovery processes are given. Commercially important processes in use in the industry for recovery of used slurry are examined in light of the consolidation trend in the Industry. The advantages and increased trends of using of in-house processes against out-sourced processes are brought out.