2.Definition of Dimensional Properties,Terminology and Methods of Silicon Carbide Wafer_Knowledge

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Home > Knowledge > 2.Definition of Dimensional Properties,Terminology and Methods of Silicon Carbide Wafer

2-21.Usable Area
2-22.Surface Roughness
2-23.Micropipe density
2-24.Wafer Orientation
2-25.FWHM
2-26.TTV
2-27.BOW
2-28.WARP
2-29.Resistivity
2-30.Dopant